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The Foundry at SEEQC

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Services:

System on a chip diagram portrait

Custom chip fabrication

Wafer-level processes from single to multi-layer structures

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Superconducting planarized multi-layer process

Standard process with multi-project wafers or dedicated wafers. Applicable for Josephson junction circuits including SFQ digital and mixed-signal circuits, analog Josephson circuits, SQUIDs, etc.

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Superconducting sensor process

Including TES, SNSPDs Nanofabrication services to incubate custom processes from startup to pre-production stage

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Superconducting and non-superconducting multi-chip module processes

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The Niobium Process

The Seeqc foundry features a complete niobium-based superconducting integrated circuit fabrication line. The niobium process has proven reliability as demonstrated by circuit operations through 7,000 thermal cycles without failure and no changes in device characteristics after five years of shelf life.

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Standard Process

Niobium technology (Nb, NbNx)
Critical current density: Available critical current densities: 100, 1000, 4500, 10000 A/cm2
Fast turnaround time: typically six weeks for 4
Nb-layer process, eight weeks for 6 Nb-layer process
High-density circuits with multi- superconducting layers: 4, 5, 6, 8
Resistor layer material and sheet resistance: Mo: 1.0 Ω/□, 2.1 Ω/□, PdAu: 2.1 Ω/□, MoNx: 4.0 Ω/

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Interlayer dielectric

PECVD SiO2 and low-loss SiNx
Proven high-volume production
Demonstrated yield and reliability
Use of Seeqc propriety simulation tools and device models, optimized subcircuits
Availability of standard subcircuits and layout primitives
Flip-chip bonding with superconducting and non-superconducting bumps

Additional Services

  • Comprehensive design rules
  • Functional and DC parametric testing
  • CAD Support and verification services
  • Mask-set composition, verification and generation
  • Cryogenic functional and high-speed testing
  • Custom Fabrication runs that include: photolithography, deposition, etching, dicing, wire bonding (normal metal, superconducting Nb), flip-chip bonding with custom specifications.